TIS809-16-02 Low Thermal Resistance Pink 0.229mm Thermally Conductive Insulator For Power Semiconductors
The TIS®809-16-02 Series of products are highly efficient insulating products and they also have thermal conductivity. It achieves the effect of both insulation and heat conduction by adding insulating silicone base material to the heat-conducting material.
Features:
> High thermal conductive and High dielectric strength
> Low thermal resistance with high voltage isolation
> Resistant to tears and punctures
> Easy release construction
> RoHS compliant
> UL recognized
Applications:
> Car Battery & Power Supply
> Power semiconductors
> Audio and Video components
> Motor controllers
> CPU
> Display card
> Mainboard/mother board
> Notebook
> Power supply
> Heat pipe thermal solutions
> Memory Modules
| Typical Properties of TIS®809-16-02 Series |
| Property | Value | Test Method |
| Color | Pink | Visual |
| Construction &Compostion | Ceramic filled silicone elastomer /Polyimide Film | ****** |
| Thickness range | 0.009inch (0.229mm) | ASTM D374 |
| Tensile Strength(MPa) | 9.0 | ASTM D412 |
| Density | 2.4 g/cc | ASTM D297 |
| Continuos Use Temp | -60 to 180℃ | ****** |
| Breakdown Voltage(V/mm) | 5500 | ASTM D149 |
| Dielectric Constant @ 1MHz | 6.0 | ASTM D150 |
| Volume Resistivity | 1.0X1012 Ohm-meter | ASTM D257 |
| Fire rating | 94 V0 | UL(E331100) |
| Thermal conductivity | 1.6W/m-K | ASTM D5470 |
| Thermal impedance(℃-in²/W)@30psi | 0.65 | ASTM D5470 |
Standard Thicknesses
0.009inch (0.229mm)
Standard Sizes
12" x 160"(304mm x 48.76M)
The TlS series can be die-cut into different shapes and provided. lf you need different thicknesses, please contact our company.
Packaging Details & Lead time
The packaging of Thermal Insulation Materials
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
Company profile
With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.
Our services
Online-service : 12 hours , Inquiry reply within fastest.
Working time: 8:00am - 5:30pm, Monday to Saturday (UTC+8).
Well-trained & experienced staff are to answer all your inquiries in English of course.
Standard Export Carton Or Marked With Customer's Information Or Customized.
Provide free samples
After-service: Even our products have passed strict inspection, if you find the parts can not work well, please show us the proof.
we will help you to deal with it and give you satisfactory solution.
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TIS809-16-02 Low Thermal Resistance Pink 0.229mm Thermally Conductive Insulator For Power Semiconductors Images
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